HODINFO is a collaborative think tank/ open science initiative. We are an International group comprised of inventors, scientist, mechanics, tinkerers, fabricators, and out of the box thinkers. Our mission is to find innovative solutions to the problems that primarily limit the production and delivery of H2. As the world starts using hydrogen it becomes clear that immense infrastructure initiatives will be required to make it happen. If adequate solutions can be found to support Hydrogen-On-Demand (HOD) systems then the world can remove great and costly limitations on future applications. The future is not just Hydrogen, it's Hydrogen-on-Demand.

I feel that electronics will be important to future development of HHO technology. Here are some photos showing what its like to work with one very small aspect of electronic systems,  surface mount capacitors.

In order to build prototypes of electronic systems,  the capacity to use surface mount components is helpful.  Some components are available only in surface mount packages.  The surface mount version of other components is sometimes much cheaper than the through-hole version. If the prototype goes to the printed circuit board phase,  the majority of the components should be surface mount. It is helpful to be able to hand assemble the initial units.

Upper left. Electronic systems usually have 0.1 microfarad capacitors between the power and ground pins of integrated circuit chips in order to "decouple" them from the power supply. I have unpopulated demo boards that use surface mount chip capacitors so I was going to also use them for breadboard prototypes. They are a lot cheaper than the through hole capacitors as well. They come on a tape, a portion of which is shown in comparison to a penny.

Upper right.  Here is a single chip capacitor sitting on a dime. It is a bit larger than the initials "JS" to the left of the year. I knew their dimensions but was still a bit surprised upon seeing how tiny they actually are.

Lower left.  Perf boards are often used for prototyping.  They have a grid of holes with 0.1 inch centers. On these particular boards, there are copper foil pads around the holes on one side.    As small as these caps are, they are still long enough to bridge the gap between adjacent foil pads.  The solder is a bit goopy but it is hard to be neat when working on something this small.  The component is pushed into place with the tip of an Xacto knife.

Lower right. My work area in the back room.  This work requires a stereo microscope with really good lighting.  Also, this microscope has a camera port with an adapter using a little Nikon P5100 CoolPix camera. Gimp is used to scale and arrange the photos. It also helps to have a nice, Weller electronically-controlled soldering iron seen to  the right of the microscope.

Additional information on HHO research can be found at our informational web site hho-research.org

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